cys t ech electronics corp. s pec. no. : c618 a3 issued date : 20 09.07.07 revised date : page no. : 1/3 LB120A3 c y s t ek product s pecification general purpose npn epitaxial planar transistor LB120A3 features ? low collector saturation voltage ? high breakdown voltage, v ceo =400v (min.) ? pb-free package symbol outline LB120A3 to-92 e c b b base c collector e emitter absolute maximum ratings (ta=25 c) parameter symbol limits unit collecto r -b ase v o ltage v cbo 600 v collector-emitter voltage v ceo 400 v emitter-base voltage v ebo 9 v collector current (dc) i c 0.5 a power dissipation p d 1 w thermal resistance, junction to ambient r ja 125 c/w junction temperature tj 150 c storage temperature tstg -55~+150 c note : pulse test, p w 10ms, duty 50%. http://
cys t ech electronics corp. s pec. no. : c618 a3 issued date : 20 09.07.07 revised date : page no. : 2/3 LB120A3 c y s t ek product s pecification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo 600 - - v i c =100 a bv ceo 400 - - v i c =1ma bv ebo 9 - - v i e =10 a i cbo - - 15 a v cb =600v, i e =0 i ebo - - 100 na v eb =8v, i c =0 *v ce(sat) - - 0.3 v i c =50ma, i b =10ma *v ce(sat) - - 0.5 v i c =200ma, i b =40ma *h fe 10 - 40 - v ce =20v, i c =20ma tf - - 0.5 ts - - 2.5 s v ce =100v, i c =300ma, i b1 =-i b2 =100ma *pulse test: pulse width 300 s, duty cycle 2% classification of h fe rank a b c d e f range 10~15 15~20 20~25 25~30 30~35 35~40
cys t ech electronics corp. s pec. no. : c618 a3 issued date : 20 09.07.07 revised date : page no. : 3/3 LB120A3 c y s t ek product s pecification to-92 dimension *: typical inches millimeters inches millimeters dim min. max . min. max . dim min. max . min. max . a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - * 0.1000 - * 2.54 c 0.5000 - 12.70 - i - * 0.0500 - * 1.27 d 0.0142 0.0220 0.36 0.56 1 - * 5 - * 5 e - * 0.0500 - * 1.27 2 - * 2 - * 2 f 0.1323 0.1480 3.36 3.76 3 - * 2 - * 2 note s: 1.controlling dimension: millimeter s. 2.maximum lead thickness include s lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is an y q uestion w i th p a ck ing specification or p a cking metho d , please c ont act y our local c y s t ek sales of fice. material: ? lead: kf c ; pu re tin plated ? mold compou n d : epoxy resin fa mily , flammabilit y solid burning cla ss: ul94v -0 im portan t n o tice : ? all rights are re served. reprod u c tion in w hole or in part is prohibited w i thout the p r ior w r itten a pprov al of c y stek. ? c y stek reserv es the right to m a ke changes to its products w i tho u t notice. ? cy st e k semic ond uct o r pr odu cts are n o t warr ante d t o be s u it able f o r use i n l i fe-su p p o rt a p p licatio ns, or sys tems. ? c y stek assumes no liability fo r an y consequenc e of customer pr oduct design, infringement of pat e n ts, or application assistance . lb 120a 3 1 a d b c i 1 e f 2 marking: 2 3 h g s t yle: pin 1.emitter 2.colle ctor 3.ba se 3-l ead t o -9 2 plastic pa ckag e cys t ek pa ck a g e code: a 3
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